JPS5546799B2 - - Google Patents
Info
- Publication number
- JPS5546799B2 JPS5546799B2 JP10638177A JP10638177A JPS5546799B2 JP S5546799 B2 JPS5546799 B2 JP S5546799B2 JP 10638177 A JP10638177 A JP 10638177A JP 10638177 A JP10638177 A JP 10638177A JP S5546799 B2 JPS5546799 B2 JP S5546799B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/752,337 US4077815A (en) | 1976-12-20 | 1976-12-20 | Water soluble flux |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5376942A JPS5376942A (en) | 1978-07-07 |
JPS5546799B2 true JPS5546799B2 (en]) | 1980-11-26 |
Family
ID=25025878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10638177A Granted JPS5376942A (en) | 1976-12-20 | 1977-09-06 | Flux composition |
Country Status (5)
Country | Link |
---|---|
US (1) | US4077815A (en]) |
JP (1) | JPS5376942A (en]) |
DE (1) | DE2741312A1 (en]) |
FR (1) | FR2374129A1 (en]) |
GB (1) | GB1537021A (en]) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE457335B (sv) * | 1984-07-20 | 1988-12-19 | Ytkemiska Inst | Flussmedel foer mjukloedning samt foerfarande foer mjukloedning med anvaendning av flussmedlet |
US4547304A (en) * | 1984-08-30 | 1985-10-15 | Texaco, Inc. | Nonfuming solder cleansing and fusing fluids |
US4568395A (en) * | 1985-05-10 | 1986-02-04 | Nabhani Abdol R | Precleaner system and soldering flux |
JPS6257795A (ja) * | 1985-09-04 | 1987-03-13 | Electroplating Eng Of Japan Co | 水溶性フラツクス |
JPS6388085A (ja) * | 1986-10-02 | 1988-04-19 | Toyo Kohan Co Ltd | めつき鋼板の後処理方法 |
DE3714268A1 (de) * | 1987-04-29 | 1988-11-10 | Basf Ag | Flussmittel und umschmelzfluessigkeiten und die verwendung von alkylenoxid-addukten in flussmittel und umschmelzfluessigkeiten |
DE3734331A1 (de) * | 1987-10-10 | 1989-04-27 | Basf Ag | Verwendung von alkylenoxid-addukten in flussmitteln und umschmelzfluessigkeiten |
JPH058085A (ja) * | 1990-11-30 | 1993-01-19 | Nippondenso Co Ltd | はんだ付け用フラツクス |
DE4131950A1 (de) * | 1991-09-25 | 1993-04-01 | Boehme Chem Fab Kg | Produkte als flussmittel und umschmelzfluessigkeiten bei der herstellung von leiterplatten |
US5215602A (en) * | 1992-05-29 | 1993-06-01 | At&T Bell Laboratories | Water-soluble flux |
US5297721A (en) * | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
US5571340A (en) * | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
DE19545676A1 (de) * | 1995-12-07 | 1997-06-12 | Wack O K Chemie Gmbh | Verfahren zum Aktivieren von Leiterplatinen |
US6159304A (en) * | 1997-07-03 | 2000-12-12 | Matsushita Electric Industrial Co., Ltd. | Solder paste |
EP0931622B1 (en) * | 1997-07-03 | 2005-10-26 | Matsushita Electric Industrial Co., Ltd. | Solder paste |
WO2015037107A1 (ja) * | 2013-09-12 | 2015-03-19 | 千住金属工業株式会社 | 洗浄用フラックス、洗浄用ソルダペースト及びはんだ継手 |
CN108687463B (zh) * | 2017-03-30 | 2021-09-21 | 株式会社田村制作所 | 预涂层用焊料组合物、印刷布线基板的制造方法、焊料组合物及电子基板的制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3436278A (en) * | 1966-08-08 | 1969-04-01 | Ibm | Glycol soldering fluxes |
US3589952A (en) * | 1968-07-05 | 1971-06-29 | Olin Mathieson | Slurry for brazing metal surfaces |
US3597285A (en) * | 1969-05-02 | 1971-08-03 | Lake Chemical Co | Flux for use in soldering of stainless steels |
US3832242A (en) * | 1970-07-23 | 1974-08-27 | Scm Corp | Brazing and solder compositions comprising a chelating agent |
US3755886A (en) * | 1971-10-22 | 1973-09-04 | Magnavox Co | Method for soldering electrical conductors |
US3865641A (en) * | 1972-01-14 | 1975-02-11 | Lake Chemical Co | Compositions for use in soldering stainless steels |
US3791879A (en) * | 1973-05-21 | 1974-02-12 | Rockwell International Corp | Solder flux composition |
-
1976
- 1976-12-20 US US05/752,337 patent/US4077815A/en not_active Expired - Lifetime
-
1977
- 1977-08-09 FR FR7725207A patent/FR2374129A1/fr active Granted
- 1977-08-24 GB GB35575/77A patent/GB1537021A/en not_active Expired
- 1977-09-06 JP JP10638177A patent/JPS5376942A/ja active Granted
- 1977-09-14 DE DE19772741312 patent/DE2741312A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2374129A1 (fr) | 1978-07-13 |
JPS5376942A (en) | 1978-07-07 |
DE2741312A1 (de) | 1978-06-29 |
US4077815A (en) | 1978-03-07 |
FR2374129B1 (en]) | 1980-12-19 |
GB1537021A (en) | 1978-12-29 |